The DUKANE 410 Ultrasonic Welder with 43C301 Converter and 700 AutoTrac Booster is a used industrial ultrasonic welding system designed for precision joining of thermoplastic components. Built to deliver consistent performance and high repeatability, this system is ideal for manufacturers seeking reliable bonding solutions. The 410 series welder integrates with the 700 AutoTrac, known for its automatic frequency tuning, and the 43C301 converter for efficient power delivery. Together, these components create a robust system suited for demanding production environments across multiple industries.

The F & K Delvotec M17LSB Ultrasonic Laserbonder is a used hybrid bonding system that integrates ultrasonic and laser bonding technologies to deliver high-precision connections for microelectronics, battery, and semiconductor applications. This unit is functional but includes a damaged key switch, which may require replacement for full operational readiness. With flexible laser wavelength options, microsecond-level energy control, and a large bonding workspace, the M17LSB is ideal for fine-pitch, high-density, and complex geometries. Designed with automation in mind, it features advanced calibration tools and vision systems to support high-throughput environments.

The F & K Delvotec M17LSB Ultrasonic Laserbonder is a used advanced wire bonding and micro-welding system, tailored for high-precision electronic and power module manufacturing. Designed to handle a wide range of materials and bonding applications, this hybrid ultrasonic and laser bonding platform combines the precision of laser welding with the adaptability of ultrasonic techniques. Featuring customizable laser wavelengths, microsecond pulse control, and a generous work envelope, the M17LSB supports fine-pitch bonding, battery tab welding, and other high-density interconnect applications with reliable speed and accuracy.

The used F&K Delvotec M17LSB Ultrasonic Laser Bonder is a high-precision wire bonding system designed for advanced microelectronic and semiconductor manufacturing applications. Combining ultrasonic and laser bonding capabilities, the M17LSB delivers consistent, high-strength bonds with precise control, making it ideal for high-reliability and high-density packaging environments. This model is known for its flexible bonding options, user-friendly interface, and robust engineering, offering dependable performance in demanding production settings.

The F & K Delvotec M17LSB is a used precision laser bonding machine, maintained in great shape and engineered for high-speed, high-accuracy bonding in advanced microelectronics and battery manufacturing. This system supports a range of laser wavelengths and power levels, enabling it to work with various materials including aluminum, copper, and nickel. Designed for maximum throughput and flexibility, the M17LSB offers automated calibration, intelligent vision systems, and adjustable pulse control for optimized welding performance. Ideal for demanding production environments, this machine supports fine-pitch, high-density assemblies with excellent repeatability and speed.