& K Delvotec M17LSB – Core Specifications
Laser Power & Wavelength
• Laser Type: Typically utilizes a pulsed laser, such as diode-pumped solid-state (DPSS) or fiber laser.
• Wavelength Options (depending on configuration):
o 1064 nm (near-infrared, standard for Nd:YAG lasers)
o Optional wavelengths may include 532 nm (green) or 355 nm (ultraviolet), depending on the material and application.
• Laser Power:
o Maximum output power up to 100 W, depending on the laser module.
o Pulse energy and duration are adjustable to suit different materials and bond geometries.
• Pulse Duration: Typically in the microsecond range, configurable for precise energy control
Maximum Bonding Size
• X/Y Travel Area: Up to 300 mm x 300 mm, depending on the specific machine configuration.
• Z-Axis Clearance: Supports bonding on components up to approximately 80 mm in height (configurable).
• Application Flexibility: Designed for high-density assemblies, fine-pitch bonding, and applications such as battery tab welding.
Bonding Speed
• Typical Speed: 1 to 3 bonds per second, influenced by:
o Bond complexity
o Material type (e.g., aluminum, copper, nickel)
o Clamping setup and heat management
o Vision system and pattern recognition speed
• Laser Dwell Time per Bond: Typically between 100 and 300 milliseconds, depending on energy requirements and bond geometry.
• Throughput Optimization: Machine features like automatic calibration and fiducial recognition help minimize setup and processing time.

DAMAGED KEY SWITCH

& K Delvotec M17LSB – Core Specifications
Laser Power & Wavelength
• Laser Type: Typically utilizes a pulsed laser, such as diode-pumped solid-state (DPSS) or fiber laser.
• Wavelength Options (depending on configuration):
o 1064 nm (near-infrared, standard for Nd:YAG lasers)
o Optional wavelengths may include 532 nm (green) or 355 nm (ultraviolet), depending on the material and application.
• Laser Power:
o Maximum output power up to 100 W, depending on the laser module.
o Pulse energy and duration are adjustable to suit different materials and bond geometries.
• Pulse Duration: Typically in the microsecond range, configurable for precise energy control
Maximum Bonding Size
• X/Y Travel Area: Up to 300 mm x 300 mm, depending on the specific machine configuration.
• Z-Axis Clearance: Supports bonding on components up to approximately 80 mm in height (configurable).
• Application Flexibility: Designed for high-density assemblies, fine-pitch bonding, and applications such as battery tab welding.
Bonding Speed
• Typical Speed: 1 to 3 bonds per second, influenced by:
o Bond complexity
o Material type (e.g., aluminum, copper, nickel)
o Clamping setup and heat management
o Vision system and pattern recognition speed
• Laser Dwell Time per Bond: Typically between 100 and 300 milliseconds, depending on energy requirements and bond geometry.
• Throughput Optimization: Machine features like automatic calibration and fiducial recognition help minimize setup and processing time.

F & K Delvotec M17LSB – Core Specifications
Laser Power & Wavelength
• Laser Type: Typically utilizes a pulsed laser, such as diode-pumped solid-state (DPSS) or fiber laser.
• Wavelength Options (depending on configuration):
o 1064 nm (near-infrared, standard for Nd:YAG lasers)
o Optional wavelengths may include 532 nm (green) or 355 nm (ultraviolet), depending on the material and application.
• Laser Power:
o Maximum output power up to 100 W, depending on the laser module.
o Pulse energy and duration are adjustable to suit different materials and bond geometries.
• Pulse Duration: Typically in the microsecond range, configurable for precise energy control
Maximum Bonding Size
• X/Y Travel Area: Up to 300 mm x 300 mm, depending on the specific machine configuration.
• Z-Axis Clearance: Supports bonding on components up to approximately 80 mm in height (configurable).
• Application Flexibility: Designed for high-density assemblies, fine-pitch bonding, and applications such as battery tab welding.
Bonding Speed
• Typical Speed: 1 to 3 bonds per second, influenced by:
o Bond complexity
o Material type (e.g., aluminum, copper, nickel)
o Clamping setup and heat management
o Vision system and pattern recognition speed
• Laser Dwell Time per Bond: Typically between 100 and 300 milliseconds, depending on energy requirements and bond geometry.
• Throughput Optimization: Machine features like automatic calibration and fiducial recognition help minimize setup and processing time.

F & K Delvotec M17LSB – Core Specifications
Laser Power & Wavelength
• Laser Type: Typically utilizes a pulsed laser, such as diode-pumped solid-state (DPSS) or fiber laser.
• Wavelength Options (depending on configuration):
o 1064 nm (near-infrared, standard for Nd:YAG lasers)
o Optional wavelengths may include 532 nm (green) or 355 nm (ultraviolet), depending on the material and application.
• Laser Power:
o Maximum output power up to 100 W, depending on the laser module.
o Pulse energy and duration are adjustable to suit different materials and bond geometries.
• Pulse Duration: Typically in the microsecond range, configurable for precise energy control
Maximum Bonding Size
• X/Y Travel Area: Up to 300 mm x 300 mm, depending on the specific machine configuration.
• Z-Axis Clearance: Supports bonding on components up to approximately 80 mm in height (configurable).
• Application Flexibility: Designed for high-density assemblies, fine-pitch bonding, and applications such as battery tab welding.
Bonding Speed
• Typical Speed: 1 to 3 bonds per second, influenced by:
o Bond complexity
o Material type (e.g., aluminum, copper, nickel)
o Clamping setup and heat management
o Vision system and pattern recognition speed
• Laser Dwell Time per Bond: Typically between 100 and 300 milliseconds, depending on energy requirements and bond geometry.
• Throughput Optimization: Machine features like automatic calibration and fiducial recognition help minimize setup and processing time.

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