The F & K Delvotec M17LSB Ultrasonic Laserbonder is a used hybrid bonding system that integrates ultrasonic and laser bonding technologies to deliver high-precision connections for microelectronics, battery, and semiconductor applications. This unit is functional but includes a damaged key switch, which may require replacement for full operational readiness. With flexible laser wavelength options, microsecond-level energy control, and a large bonding workspace, the M17LSB is ideal for fine-pitch, high-density, and complex geometries. Designed with automation in mind, it features advanced calibration tools and vision systems to support high-throughput environments.

The F & K Delvotec M17LSB Ultrasonic Laserbonder is a used advanced wire bonding and micro-welding system, tailored for high-precision electronic and power module manufacturing. Designed to handle a wide range of materials and bonding applications, this hybrid ultrasonic and laser bonding platform combines the precision of laser welding with the adaptability of ultrasonic techniques. Featuring customizable laser wavelengths, microsecond pulse control, and a generous work envelope, the M17LSB supports fine-pitch bonding, battery tab welding, and other high-density interconnect applications with reliable speed and accuracy.