▸ Key Features:
• Designed for automated semiconductor test environments
• Provides stable thermal conditioning for DUTs
• Compatible with SPEA high-volume test cells (H3560, C6000MX series)
• Supports precise temperature control for production-level validation
• Heavy-duty construction with powered cooling assemblies
• Integrated mounting structure for DUT carrier plates and interface modules
• Built for continuous-duty industrial operation
▸ Applications:
• Semiconductor device temperature cycling
• Production‑floor thermal control in automated test handlers
• Device reliability and burn‑in support
• High‑volume test cell integration
• Precision conditioning of analog, mixed‑signal, or power ICs
• DUT cooling/heating stabilization for accurate measurement
▸ Alternative Model Numbers:
C600MX160
C6000MX Series (related tester platform)
SPEA Thermal Conditioning Modules
SPEA Temperature Control Chillers (general family)
SPEA C600MX Mixed Signal Tester Add‑Ons
▸ Common Misspellings or Phrasing:
C600MX TH
SPEA C600M-XTH
SPEA C600MXT
MXTH Thermal Unit
SPEA Conditioning Chiller
