Product Specifications
- Model: M17LSB
- Bonding Method: Ultrasonic and laser hybrid bonding
- Bond Head Type: Multi-axis precision wire bonding head
- Wire Types Supported: Gold, aluminum, copper
- Wire Diameters: Supports a wide range of diameters for various applications
- Bonding Modes: Ball, wedge, and laser-stitch options
- Control Interface: Integrated touchscreen with programmable software
- Vision System: High-resolution optical alignment for target accuracy
- Power Requirements: Standard industrial power configurations
- Dimensions: Compact footprint optimized for lab or production floor use
Key Features
- Combines ultrasonic and laser bonding in a single platform
- High-speed, high-accuracy bonding performance
- Advanced pattern recognition and optical alignment system
- Versatile wire compatibility for multiple interconnect strategies
- Customizable bond parameters for varying material and package types
- Durable frame with vibration isolation for precision bonding
- User-friendly programming environment for efficient operation
- Ideal for R&D, prototyping, and volume production environments
Applications
- Semiconductor chip packaging
- Power electronics interconnects
- Automotive sensor and module assembly
- RF and microwave device bonding
- Medical device micro-assembly
Alternative model numbers include: F&K M17LSB, Delvotec M17 LSB, M17LSB Wire Bonder, F&K Laser Ultrasonic Bonder, M17LSB Hybrid Bonder
Common misspellings include: M17LS, M17LS8, FK DELVOTEC M17, Delvotek M17LSB, M17LBS
