Product Specifications:
• Model Number: WS-400B
• Manufacturer: Laurell Technologies Corporation
• Process Type: Spin etching / spin coating
• Substrate Compatibility: Up to 6-inch wafers (varies by chuck)
• Spin Speed Range: Typically up to 8000 RPM (model dependent)
• Control System: Digital programmable interface with multi-step recipes
• Drive System: Brushless motor with closed-loop feedback
• Chamber Type: Vacuum chuck with sealed process chamber
• Power Supply: Standard lab power (varies by configuration)
• Condition: Used
Key Features:
• High-speed spinning for uniform coatings or etch removal
• Customizable recipes for multi-step spin processes (speed, time, ramp rates)
• Compact bench-top design suitable for lab or cleanroom integration
• Sealed spin bowl for solvent containment and easy cleaning
• Vacuum chuck system provides secure substrate holding during spin cycles
• Proven performance in photolithography, MEMS, and thin-film applications
Applications:
• Photolithography: Spin-coating photoresists onto silicon wafers
• MEMS fabrication: Uniform layer application in microsystems engineering
• Thin film research: Controlled deposition of polymers, oxides, and solutions
• Etching processes: Wet chemical etching for substrate surface preparation
• Lab prototyping: Ideal for R&D environments requiring process repeatability
Alternative model numbers include: WS-400A, WS-400BZ-6NPP/LITE, Laurell WS-400B-6NPP, WS-400B-NPP, WS-400E
Common misspellings include: LAUREL WS-400B, WS400B Spin Coater, LAURELL WS400-B, LAURALL WS-400B, WS-400 Spin Etcher